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BOKU partners Telefonica, raises USD 35 million in funding round
(The Paypers) US online mobile payments company Boku has raised USD 35 million in a funding round led by investors NEA, Andreessen Horowitz, Dag Ventures, Index Ventures and Khosla Ventures and which also includes Spanish telecommunication services provider Telefonica.... (The Paypers) US online mobile payments company Boku has raised USD 35 million in a funding round led by investors NEA, Andreessen Horowitz, Dag Ventures, Index Ventures and Khosla Ventures and which also includes Spanish telecommunication services provider Telefonica.